Housing with integrated circuit, light micrograph. The image shows an opened transistor outline (TO) metal housing with the mounted semiconductor chip. TO packages consist of a TO base and a TO cap. The TO socket forms the base for mounting the encapsulated semiconductor component and supplies it with power. The semiconductor in this image is a 741 operational amplifier, manufactured in 1978. Golden bond wires connect the pins of the TO base with the semiconductor chip. Microscopic contrast method: incident darkfield. Magnification: x80 when printed at 10 centimetres wide.